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Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
Pages: 68
Publication date: 2019-05-14
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m¿¿¿K) and defined flammability (vertical burning test), copper-clad fo
Pages: 22
Publication date: 2018-01-10
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m¿¿¿K) and defined flammability (vertical burning test), copper-clad fo
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m¿¿¿K) and defined flammability (vertical burning test), copper-clad fo
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Pages: 86
Publication date: 2017-12-13
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Pages: 45
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Pages: 7
Publication date: 2017-07-28
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Pages: 19
Publication date: 2017-07-26
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Pages: 20
Publication date: 2017-05-30